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Influence of hole size in static strength and fatigue for CFRP composite materials Conference paper
Proceedings of the International Conference on Advanced Composite Materials
Authors:  Yip Ming-Chuen;  Perng Tzay-Biau
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NOTCH EFFECT ON TWO‐LEVEL CUMULATIVE LOW‐CYCLE FATIGUE LIFE UNDER DIFFERENT BIAXIAL LOADING MODE SEQUENCES Journal article
Fatigue & Fracture of Engineering Materials & Structures, 1995,Volume: 18,Issue: 11,Page: 1323-1332
Authors:  Yip M.-C.;  Jen Y.-M.
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Biaxial fatigue crack initiation life prediction of solid cylindrical specimens with transverse circular holes Journal article
International Journal of Fatigue, 1996,Volume: 18,Issue: 2,Page: 111-117
Authors:  Yip M.-C.;  Jen Y.-M.
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Biaxial fatigue  Finite element method  Local strain approach  Notch  
Mean strain effect on crack initiation lives for notched specimens under biaxial nonproportional loading paths Journal article
Journal of Engineering Materials and Technology, Transactions of the ASME, 1997,Volume: 119,Issue: 1,Page: 104-112
Authors:  Yip M.-C.;  Jen Y.-M.
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Effects of low-energy impact on the fatigue behavior of carbon/epoxy composites Journal article
Composites Science and Technology, 1998,Volume: 58,Issue: 1,Page: 1-8
Authors:  Tai N.H.;  Yip M.C.;  Lin J.L.
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A. polymer-matrix composites  B. fatigue  B. impact behaviour  Low-energy impact  
Effects of cyclic thermal loadings on fatigue behavior of carbon/PEEK laminates Journal article
Key Engineering Materials, 1998,Issue: 149 PART II,Page: 829-834
Authors:  Yip M.C.;  Tseng C.M.;  Tai N.H.
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C-Scan  Carbon/PEEK Laminates  Fatigue  Tension-Tension  Thermal Cycling  
Influences of thermal cycling and low-energy impact on the fatigue behavior of carbon/PEEK laminates Journal article
Composites Part B: Engineering, 1999,Volume: 30,Issue: 8,Page: 849-865
Authors:  Tai N.-H.;  Yip M.-C.;  Tseng C.-M.
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Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application Conference paper
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Jen Y.-M.
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Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application Conference paper
Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints Journal article
Journal of Electronic Materials, 2003,Volume: 32,Issue: 11,Page: 1284-1289
Authors:  Chen S.-W.;  Lee S.-W.;  Yip M.-C.
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Interfacial reactions  Mechanical properties  Ni/Sn/Ni  Sn-Cu solder  
Mechanical characterization of board-level 63Sn37Pb and lead-free solder sphere attachment on Cu-pad/Ni/Au surface finish substrate Conference paper
Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
Authors:  Fan J.-W.;  Kuo C.-T.;  Yip M.-C.
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Effect of mean strain level on the cyclic stress-strain behavior of AISI 316 stainless steel Journal article
Materials Science and Engineering A, 2003,Volume: 354,Issue: 1-2,Page: 270-278
Authors:  Chiou Y.-C.;  Yip M.-C.
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Cyclic stress-strain curve  Mean stress  Stable hysteresis loop  
Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application Conference paper
Advances in Electronic Packaging
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Creep  Strain rate  Thermo-mechanical testing  Underfill films  
Fatigue behavior of carbon/epoxy composites under hygrothermal effects Journal article
Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao, 2003,Volume: 24,Issue: 6,Page: 641-648
Authors:  Wang T.;  Yip M.-C.
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Delamination  Fatigue  Hygrothermal  
Static and fatigue analysis of double-bolted-joints for Gr/epoxy after thermal cyclic loading Book
2004
Authors:  Yip M.-C.;  Li R.-Y.;  Yang C.-H.
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Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications Journal article
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 2004,Volume: 27,Issue: 7,Page: 949-954
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Creep  Polyimide films  Strain rate  Thermo-mechanical testing  
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application Journal article
Microelectronics Reliability, 2004,Volume: 44,Issue: 4,Page: 627-638
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications Journal article
Journal of Electronic Materials, 2005,Volume: 34,Issue: 3,Page: 272-281
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Tsou C.
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Creep  Fatigue  Polyimide films  Strain rate  Thermo-mechanical testing  
Fatigue behavior of carbon/epoxy composites under pretorsion and low-energy impact effects Journal article
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 2005,Volume: 28,Issue: 2,Page: 353-357
Authors:  Wang T.;  Yip M.
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Delamination  Fatigue  Low-energy impact  Pretorsion  
Life prediction of stainless steels by cyclic and stable hysteresis curves Journal article
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 2005,Volume: 28,Issue: 2,Page: 341-351
Authors:  Chiou Y.;  Yip M.
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AISI 316 and 304 stainless steels  Branch of stable hysteresis loop  Cyclic stress-strain curve  Fatigue life