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Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd Journal article
Applied Surface Science, 2009,Volume: 255,Issue: 6,Page: 3713-3718
Authors:  Ma C.;  Ye W.;  Shi X.;  Chang Y.;  Chen Y.;  Wang C.
Favorite  |  View/Download:15/0  |  Submit date:2018/11/07
Aupd Seed  Electroless Copper  Pd Seed  Ptpd Seed