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Fabrication of stainless steel 316L/TiB2 composite coating via friction surfacing Conference paper
SURFACE & COATINGS TECHNOLOGY, Natl Dong Hwa Univ, Hualien, TAIWAN, OCT 15-18, 2017
Authors:  Guo, D.;  Kwok, C. T.;  Chan, S. L. I.
Favorite  |  View/Download:16/0  |  Submit date:2018/10/30
Friction Surfacing  Stainless Steel  Titanium Diboride  Metal Matrix Composite  Pitting Corrosion  Crystallography  
Supramolecular strategy for reducing the cardiotoxicity of bedaquiline without compromising its antimycobacterial efficacy Conference paper
FOOD AND CHEMICAL TOXICOLOGY, Kunming, PEOPLES R CHINA, AUG 25-30, 2018
Authors:  Kuok, Kit Ieng;  Ng, Phoebe Choi In;  Ji, Xia;  Wang, Chunming;  Yew, Wing Wai;  Chan, Denise P. C.;  Zheng, Jun;  Lee, Simon M. Y.;  Wang, Ruibing
View  |  Adobe PDF(423Kb)  |  Favorite  |  View/Download:174/24  |  Submit date:2018/10/30
Cucurbit[7]Uril  Bedaquiline  Supramolecular Formulation  Cardiotoxicity  Antimycobacterial  
Microstructure and bendabiltiy of AM60 and AZ61 magnesium alloy tubes Conference paper
Magnesium Technology
Authors:  Wang Y.;  Jin L.;  Zeng X.;  Ding W.;  Luo A.A.;  Sachdev A.K.;  Mishra R.K.
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AM60 alloy  AZ61 alloy  Bendability  Mechanical properties  Microstructure  Texture  
Development and validation of extrusion limit diagram for AZ31 and AM30 magnesium alloys Conference paper
Materials Science Forum
Authors:  Wang Y.;  Zeng X.;  Ding W.;  Luo A.A.;  Sachdev A.K.
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AZ31 and AM30 magnesium alloys  Extrusion limit diagram  Magnesium seamless tubes  
Study of processing map on Mg-3Al-1Zn alloy prepared by low frequency electromagnetic casting Conference paper
Magnesium Technology
Authors:  Wang Y.;  Zeng X.;  Ding W.;  Luo A.A.;  Sachdev A.K.
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AZ31 magnesium alloy  Low frequency electromagnetic casting  Processing map  
Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application Conference paper
Advances in Electronic Packaging
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Creep  Strain rate  Thermo-mechanical testing  Underfill films  
Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application Conference paper
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Jen Y.-M.
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Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application Conference paper
Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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