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Self-Assembled Formation of Well-Aligned Cu-Te Nano-Rods on Heavily Cu-Doped ZnTe Thin Films Journal article
Nanoscale Research Letters, 2016,Volume: 11,Issue: 1
Authors:  Liang J.;  Cheng M.K.;  Lai Y.H.;  Wei G.;  Yang S.D.;  Wang G.;  Ho S.K.;  Tam K.W.;  Sou I.K.
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Heavily Cu-doped ZnTe  MBE  Self-assembled nano-rods  Surface modulation  
Oxidation resistant effects of Ag2S in Sn-Ag-Al solder: A mechanism for higher electrical conductivity and less whisker growth Journal article
Corrosion Science, 2016,Volume: 105,Page: 25-35
Authors:  Kim S.H.;  Hui K.N.;  Kim Y.-J.;  Lim T.-S.;  Yang D.-Y.;  Kim K.B.;  Kim Y.J.;  Yang S.
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A. Intermetallics  A. Tin  C. Interfaces  C. Oxidation  C. Sulphidation  
Characterization of Sn-doped CuO thin films prepared by a sol–gel method Journal article
Journal of Materials Science: Materials in Electronics, 2016,Volume: 27,Issue: 2,Page: 1719-1724
Authors:  Wu J.;  Hui K.S.;  Hui K.N.;  Li L.;  Chun H.-H.;  Cho Y.R.
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