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Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications Journal article
Journal of Electronic Materials, 2005,Volume: 34,Issue: 3,Page: 272-281
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Tsou C.
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Creep  Fatigue  Polyimide films  Strain rate  Thermo-mechanical testing