UM

浏览/检索结果: 共6条,第1-6条 帮助

限定条件        
已选(0)清除 条数/页:   排序方式:
Microstructure and bendabiltiy of AM60 and AZ61 magnesium alloy tubes Conference paper
Magnesium Technology
作者:  Wang Y.;  Jin L.;  Zeng X.;  Ding W.;  Luo A.A.;  Sachdev A.K.;  Mishra R.K.
收藏  |  浏览/下载:1/0  |  提交时间:2019/01/16
AM60 alloy  AZ61 alloy  Bendability  Mechanical properties  Microstructure  Texture  
Development and validation of extrusion limit diagram for AZ31 and AM30 magnesium alloys Conference paper
Materials Science Forum
作者:  Wang Y.;  Zeng X.;  Ding W.;  Luo A.A.;  Sachdev A.K.
收藏  |  浏览/下载:0/0  |  提交时间:2019/01/16
AZ31 and AM30 magnesium alloys  Extrusion limit diagram  Magnesium seamless tubes  
Study of processing map on Mg-3Al-1Zn alloy prepared by low frequency electromagnetic casting Conference paper
Magnesium Technology
作者:  Wang Y.;  Zeng X.;  Ding W.;  Luo A.A.;  Sachdev A.K.
收藏  |  浏览/下载:1/0  |  提交时间:2019/01/16
AZ31 magnesium alloy  Low frequency electromagnetic casting  Processing map  
Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application Conference paper
Advances in Electronic Packaging
作者:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/08
Creep  Strain rate  Thermo-mechanical testing  Underfill films  
Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application Conference paper
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
作者:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Jen Y.-M.
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/08
Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application Conference paper
Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
作者:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/08