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Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application Conference paper
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
作者:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Jen Y.-M.
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/08
Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application Conference paper
Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
作者:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/08