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Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application Conference paper
Advances in Electronic Packaging
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
Favorite  |  View/Download:0/0  |  Submit date:2019/04/08
Creep  Strain rate  Thermo-mechanical testing  Underfill films