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Effect of Alkali treatment on the mechanical property of polyimide film Conference paper
Key Engineering Materials
Authors:  Zhang M.;  Liu L.;  Hui K.S.;  Hui K.N.
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Alkali treatment  Mechanical properties  Polyimide film  Surface modification  
A low-cost capacitive relative humidity sensor for food moisture monitoring application Conference paper
Proceedings of the 4th Asia Symposium on Quality Electronic Design, ASQED 2012, MALAYSIA, JUL 10-11, 2012
Authors:  Wang B.;  Law M.K.;  Bermak A.
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Effect of ion adsorption on CEC separation of small molecules using hypercrosslinked porous polymer monolithic capillary columns Journal article
JOURNAL OF SEPARATION SCIENCE, 2012,Volume: 35,Issue: 12,Page: 1502-1505
Authors:  Chen, XJ (Chen, Xiao-Jia);  Dinh, NP (Ngoc Phuoc Dinh);  Zhao, J (Zhao, Jing);  Wang, YT (Wang, Yi-Tao);  Li, SP (Li, Shao-Ping);  Svec, F (Svec, Frantisek)
View  |  Adobe PDF(524Kb)  |  Favorite  |  View/Download:340/7  |  Submit date:2018/11/01
Performance Liquid-chromatography  Stearyl-acrylate Monoliths  Large Surface-area  Stationary Phases  Efficient Separation  Electrochromatography  Peptides  Solutes  Media  Proteins  
Electrodeposition of Pt nanoparticles on carbon nanotubes-modified polyimide materials for electrocatalytic applications Journal article
Catalysis Communications, 2009,Volume: 10,Issue: 5,Page: 610-613
Authors:  Zhang X.;  Shi X.;  Wang C.
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Carbon nanotubes  Methanol  Nitrite  Polyimide  Pt nanoparticles  
Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications Journal article
Journal of Electronic Materials, 2005,Volume: 34,Issue: 3,Page: 272-281
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Tsou C.
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Creep  Fatigue  Polyimide films  Strain rate  Thermo-mechanical testing  
Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications Journal article
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 2004,Volume: 27,Issue: 7,Page: 949-954
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Creep  Polyimide films  Strain rate  Thermo-mechanical testing  
Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application Conference paper
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Jen Y.-M.
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Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application Conference paper
Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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