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A new approach to design differential-mode bandpass filters on SIW structure
Xu X.1; Wang J.1; Zhu L.2
2013
Source PublicationIEEE Microwave and Wireless Components Letters
ISSN15311309
Volume23Issue:12Pages:635
Abstract

A new approach to design differential-mode (DM) bandpass filters is proposed and implemented based on the substrate integrated waveguide (SIW) technology. By properly constructing the topologies of SIW resonant cavities, the balanced section of the proposed filter achieves an attractive capacity in simultaneously realizing the desired DM transmission and expected common-mode (CM) suppression in a certain band. In design, the specified DM frequency response is achieved with an equivalent two-port circuit model. To illustrate the possibilities of the new approach, a fourth-order Ku-band prototype is designed and fabricated on a single-layer substrate. Measured results agree well with the predicted counterparts. © 2013 IEEE.

KeywordCommon-mode (Cm) Suppression Differential-mode (Dm) Bandpass Filter (Bpf) Substrate Integrated Waveguide (Siw)
DOI10.1109/LMWC.2013.2283859
URLView the original
Indexed BySCI
Language英语
WOS Research AreaEngineering
WOS SubjectEngineering, Electrical & Electronic
WOS IDWOS:000328048800003
The Source to ArticleScopus
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被引频次[WOS]:46   [WOS记录]     [WOS相关记录]
Document TypeJournal article
专题DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Affiliation1.Ministerial Key Laboratory of JGMT, Nanjing University of Science and Technology, Nanjing 210094, China
2.Faculty of Science and Technology, University of Macau, Macau SAR, China
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Xu X.,Wang J.,Zhu L.. A new approach to design differential-mode bandpass filters on SIW structure[J]. IEEE Microwave and Wireless Components Letters,2013,23(12):635.
APA Xu X.,Wang J.,&Zhu L..(2013).A new approach to design differential-mode bandpass filters on SIW structure.IEEE Microwave and Wireless Components Letters,23(12),635.
MLA Xu X.,et al."A new approach to design differential-mode bandpass filters on SIW structure".IEEE Microwave and Wireless Components Letters 23.12(2013):635.
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