UM
Performance Analysis of Video Services over WLANs with Multi-channel Bonding
Han, Mengqi; Khairy, Sami; Cai, Lin X.; Cheng, Yu; Hou, Fen; IEEE
2017
Conference Name2017 IEEE 86TH VEHICULAR TECHNOLOGY CONFERENCE (VTC-FALL)
Publication Place345 E 47TH ST, NEW YORK, NY 10017 USA
PublisherIEEE
AbstractAn analytical model is developed to evaluate the performance of an IEEE 802.11ac Wireless Local Area Network (WLAN) in support of delay sensitive video services over multiple channels. Specifically, the channel bonding probability and the channel access delay of wireless users are analyzed, considering the contentions among legacy and ac users in the same channel and across multiple channels. Based on the analysis, the network capacity region, i.e., the maximum number of traffic flows that can be supported with the bounded delay performance in a multi-channel WLAN with and without channel bonding, is derived. Our analysis shows that channel bonding can improve the network capacity when the channel is under-utilized with a small number of legacy users co-existing with the ac users; yet channel bonding is not always favorable and it may degrade the network capacity when the number of legacy users increases due to the increased contentions in the network. The analysis provides important guidance for effective admission control and channel bonding strategies to guarantee the bonded service delay of realtime applications. Extensive simulations validate the analysis.
KeywordCapacity analysis IEEE 802.11ac WLAN multi-channel bonding unsaturated traffic bounded service delay
URLView the original
Indexed ByCPCI
Language英语
WOS Research AreaEngineering ; Telecommunications
WOS SubjectEngineering, Electrical & Electronic ; Telecommunications
WOS IDWOS:000428141601112
The Source to ArticleWOS
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Document TypeConference paper
CollectionUniversity of Macau
Recommended Citation
GB/T 7714
Han, Mengqi,Khairy, Sami,Cai, Lin X.,et al. Performance Analysis of Video Services over WLANs with Multi-channel Bonding[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2017.
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