UM
Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application
Kuo C.-T.1; Yip M.-C.1; Chiang K.-N.1; Jen Y.-M.2
2002
Source PublicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Pages188-196
AbstractThe thermo-mechanical testing of high performance polyimide films Type HPP-ST supplied by Dupont® is preceded under different strain rate and temperature environments. The stress-strain behavior of materials is simulated with constitutive framework, and the dependence of Young's modulus on temperature and strain rate is reported. In view of the uncertainty of the Young's modulus determination, the specimens were tested with unloading-reloading to verify the test results. Constant strain rate uniaxial tensile test and long-term creep test at various temperatures are preceded to characterize the time-temperature-dependent mechanical property precisely. Cyclic loading test was also performed on the specimen to investigate cyclic stress-strain behaviors. There is no research definitely related in the past, therefore the research is expected to enhance the finite-element-modeling accuracy and characterize the material properties.
DOI10.1109/EMAP.2002.1188836
URLView the original
Language英語
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Document TypeConference paper
CollectionUniversity of Macau
Affiliation1.National Tsing Hua University
2.Chung Hua University
Recommended Citation
GB/T 7714
Kuo C.-T.,Yip M.-C.,Chiang K.-N.,et al. Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application[C],2002:188-196.
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