UM
Mechanical characterization of board-level 63Sn37Pb and lead-free solder sphere attachment on Cu-pad/Ni/Au surface finish substrate
Fan J.-W.; Kuo C.-T.; Yip M.-C.
2003
Source PublicationProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
Pages712-717
AbstractThe trends of miniaturization of the electronic products make the solder joint reliability become important. Solder joint reliability is closely related to the interfacial reaction. The increasing thickness of the brittle IMC (intermetallic compound) layer will degrade the joint integrity. Considering the IMC growth mechanism, shear test and failure mode analysis are used to completely understand the behavior of solder materials. Based on IMC experiment results, activation energy and diffusion coefficients of 63Sn37Pb, Sn3.5Ag and Sn4Ag0.5Cu were obtained, and the models of IMC growth mechanism at the interface between pad finish and the solder materials also have been established. Based on shear test and failure analysis, the variations of shear strength and failure mode transition of three different solder alloys are also discussed.
DOI10.1109/EPTC.2003.1271611
URLView the original
Language英語
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Document TypeConference paper
CollectionUniversity of Macau
AffiliationNational Tsing Hua University
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GB/T 7714
Fan J.-W.,Kuo C.-T.,Yip M.-C.. Mechanical characterization of board-level 63Sn37Pb and lead-free solder sphere attachment on Cu-pad/Ni/Au surface finish substrate[C],2003:712-717.
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