UM
Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications
Kuo C.-T.1; Yip M.-C.1; Chiang K.-N.1; Tsou C.2
2005
Source PublicationJournal of Electronic Materials
ISSN03615235
Volume34Issue:3Pages:272-281
AbstractThe thermo-mechanical testing of the type HPP ST polyimide films with high performance, supplied by Dupont, was realized under different strain rates and temperature effects. Therefore, the rate-temperature-dependent stress-strain behavior of materials was investigated and the dependence of the Young's modulus on temperature and strain rate was reported. In view of the uncertainty of the Young's modulus determination, the specimens were tested with the unloading-reloading technique to verify the test results. The constant strain rate uniaxial tensile test and long-time creep test at various temperatures were performed to characterize the time-temperature-dependent mechanical property precisely. The cyclic loading test was also implemented on the specimen to investigate cyclic stress-strain behavior. In addition, the nanoindentation test was carried out at room temperature to validate the elastic modulus derived from the uniaxial tensile test. This research is expected to investigate the time-temperature-dependent mechanical behavior of the polyimide materials for different service regimes including tensile and cyclic mechanical loading under elevated temperature in a systematic manner.
KeywordCreep Fatigue Polyimide films Strain rate Thermo-mechanical testing
DOI10.1007/s11664-005-0213-3
URLView the original
Language英語
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Cited Times [WOS]:5   [WOS Record]     [Related Records in WOS]
Document TypeJournal article
CollectionUniversity of Macau
Affiliation1.National Tsing Hua University
2.Feng Chia University
Recommended Citation
GB/T 7714
Kuo C.-T.,Yip M.-C.,Chiang K.-N.,et al. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications[J]. Journal of Electronic Materials,2005,34(3):272-281.
APA Kuo C.-T.,Yip M.-C.,Chiang K.-N.,&Tsou C..(2005).Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications.Journal of Electronic Materials,34(3),272-281.
MLA Kuo C.-T.,et al."Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications".Journal of Electronic Materials 34.3(2005):272-281.
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