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Performance comparisons of emerging move-and-charge technologies for electric vehicles
Li W.1; Chau K.T.1; Ching T.W.3
2015
Conference Name17th IEEE International Conference on Electrical Machines and Systems (ICEMS)
Source Publication2014 17th International Conference on Electrical Machines and Systems, ICEMS 2014
Pages218-224
Conference DateOCT 22-25, 2014
Conference PlaceHangzhou
CountryChina
Author of SourceIEEE
Publication Place345 E 47TH ST, NEW YORK, NY 10017 USA
PublisherIEEE
Abstract

Move-and-charge technology is an emerging technology for the Electric vehicle (EV) charging. It can charge the EV wirelessly even when the EV is in motion. Therefore, the short driving range and long charging time of EVs can be satisfactorily solved. In this paper, two main move-and-charge technologies, namely the inductive power transfer (IPT) and the magnetic resonance coupling (MRC), are quantitatively analyzed and compared. By using 3-D finite element method and the equivalent circuit models, the magnetic modeling of IPT and MRC systems are established. Based on magnetic models of the two systems, the output power of primary side/transmitter, received power of secondary side/receiver, transmission characteristics and efficiencies at different situations, especially for the misalignment conditions, are obtained. Finally, based on the transmission performances, two technologies are discussed and summarized.

DOI10.1109/ICEMS.2014.7013485
URLView the original
Language英语
WOS Research AreaEngineering
WOS SubjectEngineering, Electrical & Electronic
WOS IDWOS:000382946500042
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Cited Times [WOS]:0   [WOS Record]     [Related Records in WOS]
Document TypeConference paper
CollectionDEPARTMENT OF ELECTROMECHANICAL ENGINEERING
Affiliation1.The University of Hong Kong, Shenzhen Institute of Research and Innovation
2.Universidade de Macau
3.The University of Hong Kong
Recommended Citation
GB/T 7714
Li W.,Chau K.T.,Ching T.W.. Performance comparisons of emerging move-and-charge technologies for electric vehicles[C]//IEEE. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2015:218-224.
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