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Broadband duplex-filtenna based on low-profile metallic cavity packaging
Zheng B.-L.1; Wong S.-W.2; Zhu L.3; He Y.2
2018-08-01
Source PublicationIEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN21563950
Volume8Issue:8Pages:1451-1457
Abstract

An integrated method of broadband duplex-filtenna based on a 3-D metallic cavity structure is proposed in this paper. In our design, two broadband filtennas with different operation frequency bands share the same metallic cavity-backed resonator. The two operation bands are realized with fractional bandwidths (FBWs) of 24% and 18%. The whole total FBW of two bands achieves 57%, and there are radiated nulls at the transition band showing a good filtering property. By integrating these two filtennas, a duplex-filtenna is formed with unidirectional radiation property. The radiation gain of these two filtennas exhibits good filtering property. The filtenna gain frequency responses have two transmission zeros near the lower and upper cutoff frequencies of both lower and upper operation bands. To validate the proposed concept, one cavity-backed duplex-filtenna with low-profile metallic cavity is designed and fabricated. The measured results have verified the simulation results well, and the isolation between the two wideband channels exceeds 30 dB as predicted in theory.

KeywordDuplex-filtenna Filtenna Transmission Zeros Wide Operation Band
DOI10.1109/TCPMT.2018.2793579
URLView the original
Indexed BySCI
WOS Research AreaEngineering ; Materials Science
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS IDWOS:000440874000014
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Cited Times [WOS]:2   [WOS Record]     [Related Records in WOS]
Document TypeJournal article
CollectionDEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Affiliation1.School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510640, China.
2.College of Information Engineering, Shenzhen University, Shenzhen 518320, China
3.Faculty of Science and Technology, Department of Electrical and Computer Engineering, University of Macau, Macau 999078, China.
Recommended Citation
GB/T 7714
Zheng B.-L.,Wong S.-W.,Zhu L.,et al. Broadband duplex-filtenna based on low-profile metallic cavity packaging[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2018,8(8):1451-1457.
APA Zheng B.-L.,Wong S.-W.,Zhu L.,&He Y..(2018).Broadband duplex-filtenna based on low-profile metallic cavity packaging.IEEE Transactions on Components, Packaging and Manufacturing Technology,8(8),1451-1457.
MLA Zheng B.-L.,et al."Broadband duplex-filtenna based on low-profile metallic cavity packaging".IEEE Transactions on Components, Packaging and Manufacturing Technology 8.8(2018):1451-1457.
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