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Introduction to the January Special Issue on the 2017 IEEE International Solid-State Circuits Conference
Bowman, Keith A.1; Khellah, Muhammad M.2; Kono, Takashi3; Shor, Joseph4; Mak, Pui-In5
2018-01
Source PublicationIEEE JOURNAL OF SOLID-STATE CIRCUITS
ISSN0018-9200
Volume53Issue:1Pages:3-7
Abstract

The IEEE International Solid-State Circuits Conference (ISSCC) is the premier global forum for presenting advances in solid-state circuits and system-on-a-chip. Every year since its first issue, the IEEE Journal of Solid-State Circuits has highlighted some well-received papers from the most recent ISSCC in special issues. This Special Issue covers the ISSCC Conference held in San Francisco, CA, USA, on February11–15, 2017.

DOIhttp://doi.org/10.1109/JSSC.2017.2780639
URLView the original
Indexed BySCI
Language英语
WOS Research AreaEngineering
WOS SubjectEngineering, Electrical & Electronic
WOS IDWOS:000418873800001
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
The Source to ArticleWOS
Fulltext Access
Citation statistics
Document TypeJournal article
CollectionDEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Affiliation1.Qualcomm Technologies, Inc., Raleigh, NC, USA
2.Intel Corporation, Hillsboro, OR, USA
3.Renesas Electronics Corporation, Tokyo, Japan
4.Bar Ilan University, Ramat Gan, Israel
5.University of Macau, Macau, China
Recommended Citation
GB/T 7714
Bowman, Keith A.,Khellah, Muhammad M.,Kono, Takashi,et al. Introduction to the January Special Issue on the 2017 IEEE International Solid-State Circuits Conference[J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS,2018,53(1):3-7.
APA Bowman, Keith A.,Khellah, Muhammad M.,Kono, Takashi,Shor, Joseph,&Mak, Pui-In.(2018).Introduction to the January Special Issue on the 2017 IEEE International Solid-State Circuits Conference.IEEE JOURNAL OF SOLID-STATE CIRCUITS,53(1),3-7.
MLA Bowman, Keith A.,et al."Introduction to the January Special Issue on the 2017 IEEE International Solid-State Circuits Conference".IEEE JOURNAL OF SOLID-STATE CIRCUITS 53.1(2018):3-7.
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